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iPhone 18 could bring variable aperture camera; Here are the details

IPhone 18 could bring variable aperture camera at the time of its launch in the global market. The primary lens will be produced by Sunny Opticals.

Published By: Nishit Raghuwanshi | Published: Dec 24, 2024, 05:06 PM (IST)

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While the masses are already enjoying the iPhone 16 series and waiting for the iPhone 17 Air, there are some revelations already related to iPhone 18. TF International Securities popular analyst, Ming Chi Kuo, has revealed a few details related to the M5 processors, and the possibility of a variable aperture camera on the iPhone 18. As claimed by Kuo, the iPhone 18 will make a debut in 2026 with the variable aperture sensor on its wide-angle camera. news Also Read: No iPhone 18? Apple Reportedly Prioritising Foldable iPhone Launch Next Year

This tech will let the users adjust the aperture size mechanically and enhance the quality of the shots they capture. Previous rumors related to the same suggested that the feature would be available in the iPhone 17 series as well. But now, Kuo has quashed all the rumors by saying that the feature will only debut with the iPhone 18 series. news Also Read: Apple’s First Foldable iPhone May Launch Along With iPhone 18 In 2026: Report

iPhone 18 variant aperture sensor and other details

As stated by Ming Chi Kuo, Sunny Optical is going to serve as the primary shutter supplier along with Luxshare delivering the secondary support for the same. The assembly of aperture blades will be taken care of by BE Semiconductor Industries (BESI) which will also supply the necessary equipment for the upgrade. news Also Read: Apple’s Foldable iPhone is Expected to Launch in 2026

He also suggested that the mass production of the M5 processors will begin in the first half of 2025. Apart from that, we will get to see the mass production of M5 Pro and M5 Max chipsets in the second half of 2025.

Last but not least, the mass production of the M5 Ultra processor will start in 2026. He said that the upcoming processors will be based on the server-grade system on integrated chips (Stoic) design including 2.5D packaging technology. The latest design boosts thermal performance making the chips perfect for AI app integration.