Qualcomm Snapdragon X75 5G modem announced for smartphones, private networks and more: Check details

Qualcomm today introduced a new 5G modem dubbed as the Snapdragon X75 5G. The newly introduced Snapdragon X75 5G is the successor to the Snapdragon X70 5G modem that was launched last year, and it is a part of the company’s sixth generation modem-to-antenna solutions. Qualcomm says that the Snapdragon X75 5G will be powering a host of devices including smartphones, personal computers, mobile broadband, automobile, satellite communication, industrial IoT, fixed wireless access and 5G private networks.

Qualcomm says that the Snapdragon X75 5G modem is currently sampling, and that commercial devices powered by this modem are expected to launch by the second half of 2023.

Qualcomm Snapdragon X75 5G: Features

Coming to the features, Qualcomm says that the Snapdragon X75 5G is ready to support 5G Advanced, which is the next phase of 5G. It is the first Modem-RF System with a dedicated hardware tensor accelerator, that is, Qualcomm 5G AI Processor Gen 2 that enables over 2.5 times better AI performance compared to Gen 1 modem, that is, Snapdragon X70 5G. It introduces a host of new technologies such as the Qualcomm 5G AI Suite Gen 2 that includes new AI-powered optimisations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The Qualcomm 5G AI Suite offers advanced AI-based capabilities including the sensor-assisted mmWave beam management and AI-enhanced GNSS Location Gen 2.

Other key technologies included in the Snapdragon X75 5G are — 10-carrier aggregation for mmWave, 5x downlink carrier aggregation and FDD uplink MIMO for sub-6 GHz bands for greater spectrum aggregation and capacity; a converged transceiver for mmWave and sub-6 paired with new Qualcomm QTM565 fifth generation mmWave antenna modules to produce reduced cost, board complexity, hardware footprint and power consumption; Qualcomm Advanced Modem-RF Software Suite, which the company says improves sustained performance, across user scenarios including elevators, subway trains, airports, parking garages, mobile gaming sessions and more; AI-based sensor-assisted mmWave beam management for superior connectivity reliability and AI-based location accuracy enhancements; Qualcomm 5G PowerSave Gen 4 and Qualcomm RF Power Efficiency Suite for extended battery life; Qualcomm DSDA Gen 2 support enabling 5G/4G Dual Data on two SIM cards simultaneously; Qualcomm Smart Transmit Gen 4, which Qualcomm says will enable fast, reliable and long-range uploads; and support for Snapdragon Satellite.

Qualcomm Fixed Wireless Access Platform Gen 3

Qualcomm also announced the Qualcomm Fixed Wireless Access Platform Gen 3, which Qualcomm says is a fully integrated 5G Advanced-ready fixed wireless access (FWA) platform with mmWave, Sub-6 GHz, and Wi-Fi 7 support, including 10GB Ethernet capability.

Key features of the Qualcomm Fixed Wireless Access Platform Gen 3 include — a converged mmWave-Sub-6 hardware architecture aimed at reducing footprint, cost, board complexity, and power consumption; Qualcomm Dynamic Antenna Steering Gen 2 for enhanced self-install capabilities; Qualcomm RF Sensing Suite to enable indoor mmWave CPE deployments; Qualcomm Tri-Band Wi-Fi 7, supporting up to 320MHz channels with expert Multi-Link operation for fast, lower latency, reliable connections and mesh capability for seamless coverage; flexible software architecture; and dual SIM the Gen 3 platform has support for both 5G Dual-SIM Dual Active (DSDA) and Dual-SIM Dual Standby (DSDS) configurations.

“Qualcomm FWA Gen 3 will help enable a wide range of applications and value-added services for mobile operators and provide them with a cost-effective way to deliver fiber-like internet speeds wirelessly over 5G to rural, suburban and dense urban communities helping drive global adoption of FWA and taking another step toward closing the digital divide,” Qualcomm wrote in a blog post.