iPhone 18 Pro, Pro Max, and Fold Rumored to Launch with Apple A20 Chipset Using Advanced 2nm Tech: Here’s What to Expect

Apple is expected to bring its highly-anticipated iPhone 17 series in September, just like it does every year. But what’s really buzzing these days is the rumor around iPhone 18 Pro, iPhone 18 Pro Max, and iPhone 18 Fold. The rumors reveal that the iPhone 18 line could bring one of the biggest technological leaps in recent iPhone history. The upcoming iPhone 18 series might be shaping up to be a landmark release.

As per recent report, Apple might be focusing on more advanced chip architecture and possibly even thinking the way power and speed are delivered across its Pro and future foldable models.

Here’s What We Know About iPhone 18 Pro, iPhone 18 Pro Max, and iPhoe 18 Fold:

A20 chipset Built on 2nm Process Technology:

Apple’s next-generation iPhones are already stirring excitement, with early reports suggesting that the company could bring iPhone 18, iPhone 18 Pro Max, and iPhone 18 Fold with one of the major technological advancement. The company’s much anticipated foldable iPhone could possibly be powered by the all-new A20 chip. The A20 chipset is expected to be built on the 2nm process technology with some of the best leap in the performance, efficiency, and AI processing capabilities.

iPhone 18 Pro, iPhone 18 Pro Max, and iPhone 18 Fold could possibly be the most powerful iPhones ever. If Apple brings its upcoming iPhone 187 line with 2nm process technology then it would place the brand ahead of industry competitors. It would signal a bold step forward in chip innovation and setting the stage for a new era of uktra efficient and high performance smartphones.

The A20 chipset is expected to be built on using TSMC’s second-generation 2nm technology, that is expected to arrive in 2026. Currently, Apple’s iPhone including iPhone 16 Pro is embedded with the A18 Pro chipset that is built using 3nm process technology.

But if the tech giant bring its rumored iPhone 18 series with 2nm process technology then it means these smartphone will be equipped with the smaller nanometer (nm) size, allowing chip to consume less power while delivering faster speed. This could directly translate to longer battery life, quicker app launches, better graphics handling, and more seamless multitasking.

New Chip Assembly Technique:

Apple is reportedly also working on a new method of chip assembly that too possibly using 3D stacking or chiplet designs. In this process, the different parts of the processor including CPU, GPU, and neural engine will be built separately and then stacked or connected more efficiently. This is expected to open the unprecedented levels of performance mostly in AI tasks and real-time data processing.